MPi EVS Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is broadly applied on gold bump and pad wafer screening for Display screen driver, logic, and memory gadget. MPI’s cantilever probes are the corresponding reply on the requires of fi­ne pitch, compact pad dimension, large pace, fewer cleansing, multi-DUT, high pin count, and ultra-reduced leakage needs. With fantastic craftsmanship, impressive architecture and tested methodologies according to mechanical and electrical simulation/measurement outcomes, producing MPI the very best cantilever supplier throughout the world.


FCB Probe Card

The FCB Probe Card is among the most mature technologies of buckling beam probe card. It's aimed to attain the semiconductor ship manufacture time-to-marketplace (TTM) and cost of test (COT) demand from customers. FCB is often a established Resolution for various semiconductor manufacturing tests from early engineering pilot-operates to substantial volume producing (HVM). FCB is prepared for unit requiring superior signal integrity probing (SI) and/or energy integrity probing (PI). Applications involve slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and even more. FCB guarantees the earth’s greatest General Price tag-of-ownership (COO) for various DUT apps.


EVS Probe Card

The EVS Probe Card is surely an improvement above the conventional buckling beam probe card. Essential attributes are bigger existing carrying potential (C.C.C.) and decrease well balanced Speak to drive (BCF), along with overall MEMS-like attributes. EVS can certainly satisfy the necessity of Highly developed wafer probing. Precise alignment and great planarity Manage are definitely the important components contributing to stable Make contact with resistance. With its potential and overall performance, EVS Probe Card is an excellent option for advanced probe cards.


Osprey probe card

The Osprey probe card is MPI’s Option to demand from customers for ever finer pitch. It really is created for lesser Al pad, and it is ideal for little pitch software with peripheral and comprehensive array pattern. With precise alignment and far better planarity Management, Osprey can arrive at higher productivity by multi-DUT style.  The forming wire (FW) variety needle generated with MPI’s have micro fabrication process not just delivers higher-top quality functionality and also lets quick needle substitution and shortens maintaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is equipped with MEMS wire (MW) needle which is suitable for the demand from customers of very low pressure probing. In addition it comes along with the opportunity to satisfy large C.C.C. and higher pin counts application. The MEMS process makes sure really reliable needle features, along with the Specific construction design permits exact alignment and planarity Manage.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated read more Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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